Rebound Electronics Market Insights Q2 2024 - Flipbook - Page 15
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Renesas
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Renesas Electronics has started operations at its Kofu Factory in Japan, now a dedicated 300-mm wafer fab for power
semiconductors, following a 90-billion-yen investment to reopen in May 2022 and doubling production capacity by 2025 to meet
rising demand from the electric vehicle sector.
The RC323xxA from Renesas is a versatile, high-performance jitter attenuator and clock synthesizer supporting network
synchronization and ultra-low jitter outputs, ideal for telecom, datacenter, and instrumentation applications up to 800G, with flexible
timing channel management and sync capabilities.
ONELab, led by Linaro with Renesas joining, enhances Arm-based edge and IoT device interoperability through scalable testing,
aiming to streamline certifications and ensure cloud-native readiness.
Samsung
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Samsung is set to release the Galaxy Z Fold6 Slim in China this October, featuring a larger main screen than its predecessor, a lighter
and thinner design compared to the standard Z Fold6, and an Exynos chipset, but without S Pen support due to its thinner build.
Samsung Electronics unveiled SF2, a new two-nanometer chip manufacturing node with GAA transistor design, set for initial launch in
2025, followed by improved versions SF2P in 2026 and SF2B in 2027, aimed at boosting chip performance and lowering production
expenses.
Samsung Electronics accelerates AI chip production by integrating memory chips, foundry, and packaging services into a streamlined
process, reducing production time by about 20%, aiming to meet rising demand for AI technology.
Samsung Electronics Foundry Division struggles with yield and power efficiency in its 3nm process, losing clients to TSMC; plans to
enhance competitiveness with Backside Power Delivery technology in its upcoming 2nm process.
Siemens
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Siemens increases investment in Frankfurt switchgear plant with 100 million euros, expanding facilities to support sustainable energy
solutions, including SF6-free technology, creating 400 new jobs by 2027, and emphasizing digital transformation and environmental
sustainability.
Foxconn and Siemens have partnered to enhance digital transformation and sustainability at Foxconn's manufacturing facilities,
focusing on automation, Siemens factory technology, industrial software, digital twins, and setting standards for future factories and
manufacturing processes.
Arup is leading the design of Siemens Mobility9s new £100 million manufacturing and R&D facility in Chippenham, supported by
architect AHR, aiming for completion by 2026 with a focus on sustainability and expected to employ 800 staff.
Siemens Canada is investing $14 million to modernize its Drummondville manufacturing facility, enhancing efficiency, expanding
production of switchboards and panels, and potentially increasing jobs by up to 15% by 2027 to support market demands and digital
manufacturing growth in Quebec.
ST Microelectronics
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STMicroelectronics has launched the ST4SIM-300, the industry's first embedded SIM meeting the GSMA standard SGP.32 for eSIM IoT
deployments, aiming to simplify device management and network switching while enhancing security and connectivity for IoT
applications.
STMicroelectronics receives ¬2 billion from Italy to build a silicon carbide chip factory in Sicily, advancing EU efforts to boost
semiconductor autonomy, focusing on electric vehicles and renewable energy, set to operate fully by 2032.
STMicroelectronics has launched the TSB952 dual operational amplifier, featuring 52MHz gain-bandwidth, low 3.3mA per channel
supply current at 36V, and a wide 4.5V-36V supply voltage range for versatile power-conscious designs in industrial and automotive
applications.
Toshiba
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Toshiba Electronic Devices & Storage has completed a new 300mm wafer fab and office in Japan to increase production of power
semiconductors like MOSFETs and IGBTs, set for mass production in late fiscal year 2024 to meet rising demand from automotive
electrification and industrial automation.
Toshiba completes new 300mm semiconductor fab in Japan to increase MOSFET and IGBT production by 2.5 times, integrating AI and
renewable energy for sustainability, targeting mass production by late 2024.
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