Market Insights Q3 2024 V2 - Flipbook - Page 18
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Samsung
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Hyundai Motor, Kia, and Samsung Electronics have partnered to enhance connectivity between software-defined vehicles (SDVs) and
smartphones, developing a next-generation infotainment system and user-centered mobility ecosystem.
Samsung has unveiled the 990 EVO Plus SSDs with PCIe 4.0 support, offering up to 7,250MB/s read and 6,300MB/s write speeds, 73%
greater power efficiency, and impressive performance for gaming, content creation, and business tasks, available in capacities up to
4TB this fall.
Intel and Samsung are facing delays in their fab projects due to financial and operational challenges, strengthening TSMC's position
as the leading global semiconductor manufacturer with ongoing global expansion.
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Siemens
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Siemens introduced Innovator3D IC, a Multiphysics cockpit for efficient 3D IC and chiplet design, prototyping, and analysis.
Siemens and Merck have entered a strategic collaboration to advance digital transformation in manufacturing, focusing on smart,
modular systems to enhance production speed, flexibility, and sustainability in industries like healthcare, life sciences, and
electronics.
Siemens Mobility is building a $60 million rail car facility in Horseheads, New York, to produce electric high-speed trains for Brightline
West, creating 300 jobs and supporting the development of a low-carbon rail system connecting Las Vegas and California by 2028.
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ST Microelectronics
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Edge Impulse and STMicroelectronics have partnered to enhance edge AI deployments by integrating their technologies, with new AI
solutions expected to be unveiled soon.
STMicroelectronics has introduced its fourth-generation SiC MOSFETs, enhancing power efficiency and compactness for EV traction
inverters, with 750 V devices available now and 1200 V devices expected in 2025.
STMicroelectronics experienced a sharp decline in Q2 earnings, with revenue dropping 25.3% and net income down 64%, citing weak
demand in the automotive sector and lower-than-expected industrial orders, while adjusting its full-year revenue forecast amid
industry-wide struggles.
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TDK
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TDK's new ERU33M high-current chokes use a novel alloy powder core to enhance current density and energy storage for
automotive and industrial power applications.
TDK launches the Tronics AXO314, a robust and precise closed-loop digital MEMS accelerometer for high dynamics industrial
applications, ideal for land, sea, and air surveying and mapping.
Toshiba
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Toshiba has launched its 1200V third-generation SiC Schottky barrier diodes, featuring low forward voltage and enhanced efficiency,
targeting industrial equipment like photovoltaic inverters, EV charging stations, and switching power supplies.
Toshiba has launched the TDS4A212MX multiplexer and TDS4B212MX demultiplexer switches, supporting up to 32Gbps high-speed
differential signaling with low power consumption and compact design for PCIe 5.0, USB4 Ver.2, and Thunderbolt 4 applications.
Toshiba has signed an MOU with Indonesia's PLN Nusantara Power to explore the application of CO₂ capture technology at thermal
power plants, aiming to support Indonesia's goal of carbon neutrality by 2060 through the potential adoption of CCS equipment.
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